2023 International Conference on Solid State Devices and Materials

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Poster Session

03: Interconnect / 3D Integrations / MEMS

[PS-3] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 3:00 PM - 5:00 PM Shirotori Hall (Nagoya Congress Center)

[PS-3-08 (Late News)] Surface Activated Thermo-compression Bonding of GaN to Carbon-composite and Diamond Substrate for Heat Dissipation System Applications

Nora Martinez1, Akio Wakejima2, Atsushi Tanaka3, ○Tadatomo Suga1 (1. Meisei Univ. (Japan), 2. Nagoya Inst. Tech. (Japan), 3. Nagoya Univ. (Japan))

https://doi.org/10.7567/SSDM.2023.PS-3-08

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