2023 International Conference on Solid State Devices and Materials

講演情報

印刷

Short Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

2023年9月7日(木) 13:30 〜 13:46 Room G (231, Bldg. 2)

Session Chairs: Kenji Shiojima (Univ. of Fukui), Takeo Minari (NIMS)

13:32 〜 13:34

[SO-PS-03-02] Using a CMOS MEMS Resonator System for Rapid Calibration of Thin Film Deposition Thickness

○Cheng-Yang Chang1, Chin-Te Hsin1, Ying-Zong Juang1, Sheng-Hsiang Tseng1 (1. National Applied Research Laboratories Taiwan Semiconductor Research Institute (Taiwan))

Abstract password authentication.
A password is required to view abstracts. You can find the password in the "Advance Program".The "Advance Program" is handed out at the registration desk to registered participants.

パスワード