2023 International Conference on Solid State Devices and Materials

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Short Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 1:30 PM - 1:46 PM Room G (231, Bldg. 2)

Session Chairs: Kenji Shiojima (Univ. of Fukui), Takeo Minari (NIMS)

1:34 PM - 1:36 PM

[SO-PS-03-03] On the Study of ESD-Induced Electromigration in CMOS Metallization

○Yang-Shou Hou1, Chun-Yu Lin1 (1. National Taiwan Normal Univ. (Taiwan))

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