2023 International Conference on Solid State Devices and Materials

Presentation information

Cancelled

Short Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 1:30 PM - 1:46 PM Room G (231, Bldg. 2)

Session Chairs: Kenji Shiojima (Univ. of Fukui), Takeo Minari (NIMS)

1:36 PM - 1:38 PM

[SO-PS-03-04] Characteristic Verification of Flexible Printed Circuit Applied to System Circuit and Package with High Frequency and High Speed

○Meng-Hua TU1, CHIA-LIN HSIEH1, Sung-Mao Wu1, Shang-Chih Chou2 (1. National University of Kaohsiung (Taiwan), 2. Taiwan Textile Research Institute (Taiwan))

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