Characteristic Verification of Flexible Printed Circuit Applied to System Circuit and Package with High Frequency and High Speed

Meng-Hua TU

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Short Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

2023年9月7日(木) 13:30 〜 13:46 Room G (231, Bldg. 2)

Session Chairs: Kenji Shiojima (Univ. of Fukui), Takeo Minari (NIMS)

13:36 〜 13:38

[SO-PS-03-04] Characteristic Verification of Flexible Printed Circuit Applied to System Circuit and Package with High Frequency and High Speed

^○Meng-Hua TU¹, CHIA-LIN HSIEH¹, Sung-Mao Wu¹, Shang-Chih Chou² (1. National University of Kaohsiung (Taiwan), 2. Taiwan Textile Research Institute (Taiwan))

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講演情報

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

[SO-PS-03-04] Characteristic Verification of Flexible Printed Circuit Applied to System Circuit and Package with High Frequency and High Speed

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