2023 International Conference on Solid State Devices and Materials

Presentation information

Print

Short Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 1:30 PM - 1:46 PM Room G (231, Bldg. 2)

Session Chairs: Kenji Shiojima (Univ. of Fukui), Takeo Minari (NIMS)

1:42 PM - 1:44 PM

[SO-PS-03-07 (Late News)] Light Enhanced Direct Copper Bonding and the Drop Test Reliability

Zong-Yu Xie1, Po-Kai Huang1, ○Wei-Ting Chen1, Chih-Pin Hung2, Kiyokazu Yasuda3, Jenn-Ming Song1,3,4 (1. National Chung Hsing University (Taiwan), 2. Advanced Semiconductor Engineering Group (Taiwan), 3. Division of Materials and Manufacturing Science (Japan), 4. Innovation and Development Center of Sustainable Agriculture (Taiwan))

Abstract password authentication.
PA password is required to view abstracts. You can find the password in the "Advance Program".The "Advance Program" is handed out at the registration desk to registered participants.

Password