2023 International Conference on Solid State Devices and Materials

講演情報

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Short Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

2023年9月7日(木) 13:30 〜 13:46 Room G (231, Bldg. 2)

Session Chairs: Kenji Shiojima (Univ. of Fukui), Takeo Minari (NIMS)

13:42 〜 13:44

[SO-PS-03-07 (Late News)] Light Enhanced Direct Copper Bonding and the Drop Test Reliability

Zong-Yu Xie1, Po-Kai Huang1, ○Wei-Ting Chen1, Chih-Pin Hung2, Kiyokazu Yasuda3, Jenn-Ming Song1,3,4 (1. National Chung Hsing University (Taiwan), 2. Advanced Semiconductor Engineering Group (Taiwan), 3. Division of Materials and Manufacturing Science (Japan), 4. Innovation and Development Center of Sustainable Agriculture (Taiwan))

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