International Display Workshops General Incorporated Association

16:10 〜 18:10

[FMCp1-1] A Novel Strategy of Multi-layer Metal Electrode for Mini-LED Backlight Using 4-mask Process

*Baolai Jiang1, Junling Liu1, Liangyi Cai1, Zhiying Li1, Qinzun Lin1, Xianwang Wei1, Yifeng Yang1, Conglong Zhang1 (1. TCL China Star Optoelectronics Technology Co., Ltd.(China))

mini-LED backlight, MoTi/Cu/MoTi layer, electrical properties, bond strength

https://doi.org/10.36463/idw.2020.0276

Mini/Micro LED are highly desirable for next-generation consumer displays. However, the potential application of Mini/Micro LED are strongly hindered by their potential high-temperature damages after the LED surface mounting process. Herein, a new low-cost strategy for Mini-LED backlight with a 4-Mask process is reported, which used MoTi/Cu/MoTi 3-layer S/D electrodes structure to replace additional ITO layer. The electrical performance and bond strength of LED and chip on film(COF) of backlight system was comparable to those of 5-Mask Mini-LED backlight.