[FMCp3-4] Cu Process Development of 43UD DRD TFT Architecture by Halftone Photolithography 4-Mask Technology
Cu process, Undercut, Passivation via hole, Interface, Pre-treatment
Screen abnormality is a subject that needs to be overcome in the development of the TFT-LCD Cu process. Passivation undercut is one of the more difficult line defect problems to overcome because the ITO contacts M1 or M2 are discontinuous in the via hole causing screen anomalies. We describe in detail our approach to improve undercut of passivation via hole. The problem without any other side...