International Display Workshops General Incorporated Association

14:00 〜 14:20

[MEET1-4 (Invited)] Nanoscale Semiconductor Devices Fabricated using Adhesion Lithography at Low Cost

*Gwenhivir Wyatt-Moon1、Oliver J Burton1、Stephan Hofmann1、Andrew J Flewitt1 (1.University of Cambridge (UK))

Nanoelectronics, Bottom-Up fabrication , Large-area electronics

https://doi.org/10.36463/idw.2022.0854

As device features sizes decrease typically fabrication costs increase. By combining adhesion lithography, a fabrication technique to create nanodevices with bottom-up nanomaterial growth this manufacturing rule has been broken. Not only is the fabrication cheaper but there is a decrease in material wastage as compared to traditional top-down fabrication processes