The Japan Society of Applied Physics

[B2-2] A Novel Planar Multilevel Interconnection Technology Utilizing Polyimide

SEIKI HARADA, KIKUJI SATO, ATSUSHI SAIKI, TAKESHI KIMURA TOSHIO OKUBO, KIICHIRO MUKAI (1.Central Research Laboratory, Hitachi Ltd.)

https://doi.org/10.7567/SSDM.1974.B2-2