[B2-2] A Novel Planar Multilevel Interconnection Technology Utilizing Polyimide
SEIKI HARADA, KIKUJI SATO, ATSUSHI SAIKI, TAKESHI KIMURA TOSHIO OKUBO, KIICHIRO MUKAI
(1.Central Research Laboratory, Hitachi Ltd.)
https://doi.org/10.7567/SSDM.1974.B2-2