[A-5-4] Low Leakage SOIMOSFETs Fabricated Using a Wafer Bonding Method

M. Hashimoto, A. Ogasawara, M. Shimanoe, A. Nieda, H. Satoh, A. Yagi, T. Matsushita (1.Research & Development Div., Semiconductor Group Sony Corp)

https://doi.org/10.7567/SSDM.1989.A-5-4