[A-5-4] Low Leakage SOIMOSFETs Fabricated Using a Wafer Bonding Method
M. Hashimoto、A. Ogasawara、M. Shimanoe、A. Nieda、H. Satoh、A. Yagi、T. Matsushita
(1.Research & Development Div., Semiconductor Group Sony Corp)
https://doi.org/10.7567/SSDM.1989.A-5-4
