[C-9-6] Limitations of Trench Cell Process Technologies for Submicron DRAMs

S. Auer, J. Dietl, L. DoThanh, B. Ganter, K. H. Kusters, P. Kupper, L. Kusztelan, H. M. Muhlhoff, W. Muller, F. X. Stelz (1.Siemens AG)

https://doi.org/10.7567/SSDM.1990.C-9-6