[C-9-6] Limitations of Trench Cell Process Technologies for Submicron DRAMs

S. Auer、J. Dietl、L. DoThanh、B. Ganter、K. H. Kusters、P. Kupper、L. Kusztelan、H. M. Muhlhoff、W. Muller、F. X. Stelz (1.Siemens AG)

https://doi.org/10.7567/SSDM.1990.C-9-6