[PB7-5] Elimination of Metal-Sputtering Contamination in Ion Implanter for Low-Leakage-Current pn Junction Formation

Y. Kato, S. Shimonishi, T. Ohmi, T. Shibata, T. Nitta (1.Department of Electronics, Tohoku University, 2.Device Development Center, Hitachi Ltd.)

https://doi.org/10.7567/SSDM.1991.PB7-5