[PC-1-1] Single Step Gap Filling Technology for Subhalf Micron Metal Spacings on Plasma Enhanced TEOS/O2 Chemical Vapor Deposition System
Katsuyuki MUSAKA、Shinsuke MIZUNO、Kiyoaki HARA
(1.Applied Materials Japan Inc. Technology Center)
https://doi.org/10.7567/SSDM.1993.PC-1-1
