Accelerated Electromigration Testing of Giant-Grain Copper Interconnects under Extremely Large Current Stress

T. Hoshi; H. Yamada; T. Takewaki; T. Shibata; T. Ohmi; T. Nitta

doi:https://doi.org/10.7567/SSDM.1993.PC-1-18

[PC-1-18] Accelerated Electromigration Testing of Giant-Grain Copper Interconnects under Extremely Large Current Stress

T. Hoshi、H. Yamada、T. Takewaki、T. Shibata、T. Ohmi、T. Nitta (1.Department of Electronic Engineering, Tohoku University、2.Laboratory for Microelectronics, Research Institute of Electrical Communication, Tohoku University、3.Device Development Center, Hitachi Ltd.)

https://doi.org/10.7567/SSDM.1993.PC-1-18

1993 International Conference on Solid State Devices and Materials

[PC-1-18] Accelerated Electromigration Testing of Giant-Grain Copper Interconnects under Extremely Large Current Stress