[PC-3-3] Comparison of CVD and PVD TaN as Diffusion Barriers for Al and Cu Metallization

S. C. Sun, M. H. Tsai, C. E. Tsai, H. T. Chiu (1.National Nano Device Laboratory and Department of Electronics Engineering, 2.Institute of Applied Chemistry National Chiao Tung University)

https://doi.org/10.7567/SSDM.1995.PC-3-3