[S-IV-10] Double-Level Cu Inlaid Interconnects with Simultaneously Filled Via-Plugs

G. Minamihaba、Y. Shimooka、H. Tamura、T. Iijima、T. Kawanoue、H. Hirabayashi、N. Sakurai、H. Ookawa、T. Obara、H. Egawa、T. Idaka、T. Kubota、T. Shimizu、M. Koyama、G. Ooshima、K. Suguro (1.ULSI Research Laboratories, Manufacturing Engineering Research Center, Semiconductor Division, TOSHIBA Corporation)

https://doi.org/10.7567/SSDM.1995.S-IV-10