Gap-Filling of Cu Employing Self-Sustained Sputtering with ICP Ionization

Takanori ICHIKI; Toshiaki KIKUCHI; Atsushi SANO; Shoso SHINGUBARA; Yasuhiro HORIIKE

doi:https://doi.org/10.7567/SSDM.1996.A-3-3

[A-3-3] Gap-Filling of Cu Employing Self-Sustained Sputtering with ICP Ionization

Takanori ICHIKI、Toshiaki KIKUCHI、Atsushi SANO、Shoso SHINGUBARA、Yasuhiro HORIIKE (1.Department of Electrical & Electronics Engineering, Toyo University、2.Department of Electrical Engineering, Hiroshima University)

https://doi.org/10.7567/SSDM.1996.A-3-3

1996 International Conference on Solid State Devices and Materials

[A-3-3] Gap-Filling of Cu Employing Self-Sustained Sputtering with ICP Ionization