[A-3-4] A Study of Via-Electromigration Failure in Multilevel Interconnection with High Temperature Sputtered Aluminum

Makiko Kageyama、Keiichi Hashimoto、Hiroshi Onoda (1.VLSI R&D Center, Oki Electric Industry Co., Ltd.)

https://doi.org/10.7567/SSDM.1996.A-3-4