[A-6-2] A New Method for Measurement of Micro Defects near the Surface of Si Wafers--Optical Shallow Defect Analyzer (OSDA)--

Kazuo Takeda、Hidetsugu Ishida、Atsushi Hiraiwa (1.Central Research Lab., Hitachi, Ltd.、2.Semiconductor & Integrated Circuit Division, Hitachi, Ltd.)

https://doi.org/10.7567/SSDM.1996.A-6-2