[PC-8-7] Application of SiOF Film Deposited Using TEOS/TEFS/O2 System to Multi-Level Interconnection Designed with 0.25μm Rule

Hiroshi KUDO, Yukihiro SATHO, Hisashi MIYAZAWA, Hideki HARADA, Atsuo SHIMIZU (1.Thin Film Technology Department and Process Integration Department, Process Development Division, Fujitsu Limited)

https://doi.org/10.7567/SSDM.1996.PC-8-7