[PD-3-2] Correlation of W-Si-N Film Microstructure with Barrier Performance against Cu Diffusion

Yoshiaki SHIMOOKA, Tadashi IIJIMA, Shinichi NAKAMURA, Kyoichi SUGURO (1.Microelectronics Engineering Lab., Environmental Engineering Labs., TOSHIBA Corporation)

https://doi.org/10.7567/SSDM.1996.PD-3-2