[PD-3-3] A Comparative Study of CVD and PVD Tungsten Nitride Diffusion Barriers for Cu Metallization

S. C. Sun, M. H. Tsai, H. T. Chiu, S. H. Chuang, M. C. Chen, W. K. Yeh, T. D. Wu (1.National Nano Device Laboratory and Department of Electronics Engineering Institute of Applied Chemistry National Chiao Tung University)

https://doi.org/10.7567/SSDM.1996.PD-3-3