[Sympo.I-2] Wafer Direct Bonding at Room Temperature by Means of the Surface Activated Bonding

Tadatomo SUGA、Taek Ryong CHUNG、Liu YANG、Naoe HOSODA、Hideki TAKAGI (1.The University of Tokyo, RCAST、2.Mechanical Engineering Lab. AIST, MITI)

https://doi.org/10.7567/SSDM.1996.Sympo.I-2