[Sympo.I-2] Wafer Direct Bonding at Room Temperature by Means of the Surface Activated Bonding

Tadatomo SUGA, Taek Ryong CHUNG, Liu YANG, Naoe HOSODA, Hideki TAKAGI (1.The University of Tokyo, RCAST, 2.Mechanical Engineering Lab. AIST, MITI)

https://doi.org/10.7567/SSDM.1996.Sympo.I-2