[A-10-3] Advanced Ti Silicide Technology with Buffer Thin Al Layer

A. Kishi, T. Doi, S. Ohnisi, K. Iguti, K. Sakiyama, Jer-shen Maa, S. T. Hsu (1.VLSI Development Laboratories, IC Group, SHARP Corporation, 2.Process Development Center, IC Group, SHARP Corporation, 3.Sharp Microelectronics Technology, Inc.)

https://doi.org/10.7567/SSDM.1997.A-10-3