[A-10-3] Advanced Ti Silicide Technology with Buffer Thin Al Layer

A. Kishi、T. Doi、S. Ohnisi、K. Iguti、K. Sakiyama、Jer-shen Maa、S. T. Hsu (1.VLSI Development Laboratories, IC Group, SHARP Corporation、2.Process Development Center, IC Group, SHARP Corporation、3.Sharp Microelectronics Technology, Inc.)

https://doi.org/10.7567/SSDM.1997.A-10-3