[A-14-3] New Three-Dimensional Wafer Bonding Technology Using Adhesive Injection Method

T. Matsumoto, M. Satoh, K. Sakuma, H. Kurino, N. Miyakawa, H. Itani, M. Koyanagi (1.Dept. of Machine Intelligence and System Engineering, Tohoku University, 2.Fuji Xerox Co., 3.Mitsubishi Heavy Industry Co.)

https://doi.org/10.7567/SSDM.1997.A-14-3