Application of Reversed Silicon Wafer Direct Bonding to Thin-Film SOI Power Ics

Toshihiko Ishiyama; Satoshi Matsumoto; Yasushi Hiraoka; Tatsuo Sakai; Toshiaki Yachi; Akio Itoh; Yoshihiro Arimoto

doi:https://doi.org/10.7567/SSDM.1997.B-7-1

[B-7-1] Application of Reversed Silicon Wafer Direct Bonding to Thin-Film SOI Power Ics

Toshihiko Ishiyama, Satoshi Matsumoto, Yasushi Hiraoka, Tatsuo Sakai, Toshiaki Yachi, Akio Itoh, Yoshihiro Arimoto (1.NTT Integrated Information & Energy Systems Laboratories, 2.Fujitsu Laboratories Ltd.)

https://doi.org/10.7567/SSDM.1997.B-7-1

1997 International Conference on Solid State Devices and Materials

[B-7-1] Application of Reversed Silicon Wafer Direct Bonding to Thin-Film SOI Power Ics