Application of Reversed Silicon Wafer Direct Bonding to Thin-Film SOI Power Ics

Toshihiko Ishiyama; Satoshi Matsumoto; Yasushi Hiraoka; Tatsuo Sakai; Toshiaki Yachi; Akio Itoh; Yoshihiro Arimoto

doi:https://doi.org/10.7567/SSDM.1997.B-7-1

[B-7-1] Application of Reversed Silicon Wafer Direct Bonding to Thin-Film SOI Power Ics

Toshihiko Ishiyama、Satoshi Matsumoto、Yasushi Hiraoka、Tatsuo Sakai、Toshiaki Yachi、Akio Itoh、Yoshihiro Arimoto (1.NTT Integrated Information & Energy Systems Laboratories、2.Fujitsu Laboratories Ltd.)

https://doi.org/10.7567/SSDM.1997.B-7-1

1997 International Conference on Solid State Devices and Materials

[B-7-1] Application of Reversed Silicon Wafer Direct Bonding to Thin-Film SOI Power Ics