[A-6-1] Copper Interconnects for Advanced Logic and DRAM

James G. Ryan, Gary B. Bronner, John P. Hummel, Thomas N. Theis (1.IBM Microelectronics, SRDC and, 2.IBM Research, T.J. Watson Research Center)

https://doi.org/10.7567/SSDM.1998.A-6-1