[A-7-5] Highly Uniform Deposition of LP-CVD 3i3N4 Films on Tungsten for Advanced Low Resistivity "Poly-Metal" Gate Interconnects

Yasushi Akasaka, Kiyotaka Miyano, Kazuaki Nakajima, Kyoichi Suguro (1.Microelectronics Engineering Laboratory, Toshiba Corp.)

https://doi.org/10.7567/SSDM.1998.A-7-5