[A-7-8] Ultra-Low Ressitance, Through-Wafer Via (TWV) Technology and Its Applications in Three Dimensional Structures on Silicon

Hyongsok T. Soh、C. Patrick Yue、Anthony M. McCarthy、Changsup Ryu、Thomas H. Lee、Calvin F. Quate (1.E. L. Ginzton Laboratory and Center for Integrated Systems, Stanford University、2.Lawrence Livermore National Laboratory)

https://doi.org/10.7567/SSDM.1998.A-7-8