[A-7-9] A New Wafer-Scale Chip-on-Chip (W-COC) Packaging Technology Using Adhesive Injection Method

K. Sakuma, K. W. Lee, T. Nakamura, H. Kurino, M. Koyanagi (1.Dept. of Machine Intelligence and System Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.1998.A-7-9