[B-4-5] Through-the-Gate Implanted (TGI) CMOS Technology with Advanced Shallow Trench Isolation

U. Schwalke、M. Fuldner、W. Zatsch、K. Bothe、D. Hadawi、I. Janssen、P. Schon (1.Siemens Corporate Technology, Siemens Semiconductor Division)

https://doi.org/10.7567/SSDM.1998.B-4-5