[B-4-5] Through-the-Gate Implanted (TGI) CMOS Technology with Advanced Shallow Trench Isolation

U. Schwalke, M. Fuldner, W. Zatsch, K. Bothe, D. Hadawi, I. Janssen, P. Schon (1.Siemens Corporate Technology, Siemens Semiconductor Division)

https://doi.org/10.7567/SSDM.1998.B-4-5