New Low k Material &quot;LKD TM&quot; for Al Damascene Process Application

R. Nakata; M. Kawai; N. Yamada; H. Miyajima; K. Higashi; H. Ichinose; S. Seta; Y. Matsui; G. Minamihaba; N. Matsunaga; N. Hayasaka

doi:https://doi.org/10.7567/SSDM.1999.B-13-3

1999 International Conference on Solid State Devices and Materials

Sep 21, 1999 - Sep 24, 1999
Nihon Toshi Center Kaikan, Tokyo, Japan

[B-13-3] New Low k Material "LKD TM" for Al Damascene Process Application

R. Nakata, M. Kawai, N. Yamada, H. Miyajima, K. Higashi, H. Ichinose, S. Seta, Y. Matsui, G. Minamihaba, N. Matsunaga, N. Hayasaka (1.ULSI Process Engineering Laboratory, TOSHIBA CORPORATION)

https://doi.org/10.7567/SSDM.1999.B-13-3

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