[B-5-3] A Low Thermal-Budget High-Performanced 0.25-0.18um Merged Logic and DRAM

W. K. Yeh、Y. C. Lin、T. P. Chen、K. C. Huang、Haber Chen、M. T. Lin、L. J. Chou、Samuel Tsang、Kirk Hsu、W. J. Lin、L. T. Jung、S. C. Chien、S. W. Sun、F. T. Liou (1.United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Division)

https://doi.org/10.7567/SSDM.1999.B-5-3