[A-2-1] Reliability and Electromigration Failure Modes in Dual Inlaid Cu Interconnects

C. Capasso、M. Herrick、M. Gall、D. Jawarani、S. Thrasher、L. Zhao、H. Kawasaki (1.Advanced Products Research and Development Laboratory DigitalDNA TM Laboratories, Motorola、2.Technology Development Group, Advanced Micro Devices)

https://doi.org/10.7567/SSDM.2000.A-2-1