[A-2-3] Ultra-Thin Silicon Oxynitride Films as Cu Diffusion Barrier for Lowering Interconnect Resistivity

Tetsuhiro Nanbu, Katsuyuki Sekine, Yuji Saito, Shin-ichi Nakao, Masaki Hirayama, Tadahiro Ohmi (1.Department of Electronic Engineering, Graduate School of Engineering, Tohoku University, 2.New Industry Creation Hatchery Center, Tohoku University)

https://doi.org/10.7567/SSDM.2000.A-2-3