[A-2-3] Ultra-Thin Silicon Oxynitride Films as Cu Diffusion Barrier for Lowering Interconnect Resistivity

Tetsuhiro Nanbu、Katsuyuki Sekine、Yuji Saito、Shin-ichi Nakao、Masaki Hirayama、Tadahiro Ohmi (1.Department of Electronic Engineering, Graduate School of Engineering, Tohoku University、2.New Industry Creation Hatchery Center, Tohoku University)

https://doi.org/10.7567/SSDM.2000.A-2-3