The Japan Society of Applied Physics

[A-8-3] Interconnect and Substrate Structure for High Speed Giga-Scale Integration

Akihiro Morimoto、Koji Kotani、Sigetoshi Sugawa、Tadahiro Ohmi (1.Department of Electronic Engineering, Graduate School of Engineering, Tohoku University、2.New Industry Creation Hatchery Center, Tohoku University)

https://doi.org/10.7567/SSDM.2000.A-8-3