Interconnect and Substrate Structure for High Speed Giga-Scale Integration

Akihiro Morimoto; Koji Kotani; Sigetoshi Sugawa; Tadahiro Ohmi

doi:https://doi.org/10.7567/SSDM.2000.A-8-3

[A-8-3] Interconnect and Substrate Structure for High Speed Giga-Scale Integration

Akihiro Morimoto, Koji Kotani, Sigetoshi Sugawa, Tadahiro Ohmi (1.Department of Electronic Engineering, Graduate School of Engineering, Tohoku University, 2.New Industry Creation Hatchery Center, Tohoku University)

https://doi.org/10.7567/SSDM.2000.A-8-3

2000 International Conference on Solid State Devices and Materials

[A-8-3] Interconnect and Substrate Structure for High Speed Giga-Scale Integration