Interconnect and Substrate Structure for High Speed Giga-Scale Integration

Akihiro Morimoto; Koji Kotani; Sigetoshi Sugawa; Tadahiro Ohmi

doi:https://doi.org/10.7567/SSDM.2000.A-8-3

2000 International Conference on Solid State Devices and Materials

2000年8月29日〜 2000年8月31日
Sendai International Center, Sendai, Japan

[A-8-3] Interconnect and Substrate Structure for High Speed Giga-Scale Integration

Akihiro Morimoto、Koji Kotani、Sigetoshi Sugawa、Tadahiro Ohmi (1.Department of Electronic Engineering, Graduate School of Engineering, Tohoku University、2.New Industry Creation Hatchery Center, Tohoku University)

https://doi.org/10.7567/SSDM.2000.A-8-3

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