[A-9-2] Deep Trench Etching in SOI Wafer for Three-Dimensional LSIs

K. W. Lee, T. Nakamura, Y. Yamada, K. T. Park, H. Kurino, M. Koyanagi (1.Dept. of Machine Intelligence and Systems Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2000.A-9-2