[A-9-2] Deep Trench Etching in SOI Wafer for Three-Dimensional LSIs

K. W. Lee、T. Nakamura、Y. Yamada、K. T. Park、H. Kurino、M. Koyanagi (1.Dept. of Machine Intelligence and Systems Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2000.A-9-2