[A-6-3] A Technology for Suppressing Inter-Layer Dielectric Crack in a High Density DRAM

B. C. Kim、D. H. Kim、W. K Huh、M. K. Bae、J. W. Nam、S. C. Lee、J. S. Kim、T. K. Kim、Y. J. Park、J. S. Park、K. N. Kim (1.Semiconductor R&D Center, Samsung Electronics Co., Ltd.)

https://doi.org/10.7567/SSDM.2001.A-6-3